Oxide Reduction in Advanced Metal Stacks for Microelectronic Applications
نویسندگان
چکیده
منابع مشابه
Oxide Reduction in Advanced Metal Stacks for Microelectronic Applications
Aluminum and copper are widely used for microelectronic interconnect applications. Interfacial oxides can cause device performance degradation and failure by significantly increasing electrical resistance. Interfacial oxide layers found in Al/Ta and Ta/Cu metal stacks were studied using Transmission Electron Microscopy (TEM) combined with Energy Dispersive Spectroscopy (EDS) and Parallel Electr...
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ژورنال
عنوان ژورنال: MRS Proceedings
سال: 2003
ISSN: 0272-9172,1946-4274
DOI: 10.1557/proc-786-e6.33